Leaks Suggest a Powerful New AMD Chip for the Next Xbox Console
Recent leaks have revealed details about a powerful new AMD chip that is believed to be connected to Microsoft’s upcoming Xbox console. This information comes from an insider who has shared insights into what could potentially be under the hood of the next generation of consoles.
While it may seem early to talk about a new console generation, given that both the PlayStation 5 and Xbox Series X/S are still in their early stages, industry experts suggest that the next wave of consoles might be just a few years away. Sony’s PlayStation 6 is expected to arrive in 2027, while Microsoft’s next console could launch even sooner. Both companies have already started discussing their future plans, with Microsoft promising the “largest technical leap” ever seen in a hardware generation.
These statements from Microsoft are often viewed as typical company posturing, with many believing they are related to advancements in artificial intelligence. However, a recent leak of a new AMD chip has sparked interest in what might be coming for the next Xbox.
The leak was first shared by YouTuber Moore’s Law Is Dead, known for previously revealing specifications about the Switch 2. In a new video, he claims to have details about a custom Zen 6 APU (accelerated processing unit) from AMD, codenamed Magnus.
During the video, the YouTuber highlights several key features of the APU. One notable aspect is its 384-bit bus, which is used to transfer memory efficiently. This is significantly larger than the 320-bit bus found in the Xbox Series X, which currently holds the record for the largest bus on the console market. The Xbox One X also used a similar bus in the past.
In addition to the bus size, the APU includes an unusual total of 11 CPU cores. These are split between three Zen6 cores and eight Zen6c cores. The system on a chip is also notably large, measuring 144mm². It is connected via a bridge die to a “massive” 264mm² graphics die, suggesting significant improvements in performance and capabilities.
Key Features of the New AMD Chip
- 384-bit Bus: Provides efficient memory transfer, surpassing the current standard in the Xbox Series X.
- 11 CPU Cores: Comprised of three Zen6 cores and eight Zen6c cores, offering enhanced processing power.
- Large System on a Chip (SoC): Measuring 144mm², indicating advanced hardware design.
- Massive Graphics Die: A 264mm² graphics die connected via a bridge die, suggesting powerful graphical capabilities.
These specifications hint at a major upgrade for the next Xbox console, potentially setting a new benchmark in gaming technology. While the exact release date and other details remain speculative, the leak has generated excitement among gamers and industry analysts alike.
As more information becomes available, it will be interesting to see how these technological advancements shape the future of gaming consoles. For now, the focus remains on the potential of this new AMD chip and what it could mean for the next generation of Xbox consoles.
